High-Density Interface Module Expansion

The IMF-3 is a high-capacity 3RU interface module frame designed to host up to eleven specialty interface modules for Eclipse HX digital matrix intercom systems. It provides an efficient and scalable solution for expanding connectivity between the intercom matrix and external communication equipment.

Broad System Integration

The frame supports a wide range of interface modules that allow integration with multiple communication technologies. These include four-wire audio connections, two-wire partyline systems, two-way radio interfaces, telephone lines, digital AES audio connections, and GPIO control interfaces.

Seamless Eclipse HX Compatibility

Audio interface modules installed in the IMF-3 operate through the MVX-16A interface card, providing reliable integration with Eclipse HX matrix systems. Control modules such as GPIO interfaces can connect through the Eclipse CPU card to enable system automation and external control functions.

Scalable Installation Options

Interface modules can be installed directly within Eclipse HX frames or inside external interface frames such as the IMF-3. This flexible architecture allows communication systems to scale depending on the number of devices and communication paths required for broadcast or live production environments.

Redundant Power Support

The IMF-3 frame operates with the PSU-101 external power supply and supports redundant power connections for increased reliability. This ensures stable operation in mission-critical communication environments including broadcast studios, control rooms, and large production facilities.